Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

Ultra-performance hybrid thermal paste, 5.2 W/mK, Non-curing compound, Grey

Key Features

• Designed with hybrid silicone and nano-diamond particles for ultra-performance
• Non-curing and non-electrically conductive properties
• Conveniently included wipes and spreader

Description

Nano-Diamond Particles for Superior Heat Transmission
Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.

Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.

Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.

Specifications

Features
Type	Thermal paste
Thermal resistance	0.04 °C/W
Viscosity note	6000000
Thermal conductivity	5.2 W/m·K
Operating temperature (T-T)	-50 - 250 °C
Product colour	Grey
Specific gravity	2.6 g/cm³
Weight & dimensions
Weight	5 g
Packaging data
Quantity per pack	1 pc(s)
Technical details
Thermal resistance	0.04 °C/W
Viscosity note	6000000
Thermal conductivity	5.2 W/m·K
Operating temperature (T-T)	-50 - 250 °C
Operational conditions
Operating temperature (T-T)	-50 - 250 °C
Colour
Product colour	Grey
Logistics data
Quantity per pack	1 pc(s)