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AMD

AMD EPYC 7313P processor 3 GHz 128 MB L3 Tray

SKU 100-000000339
£355.10
£355.10
Excluding taxes
16 cores, 32 threads, 3.0 GHz base frequency, 3.7 GHz boost frequency, 128MB L3 cache, 155W TDP

Description

AMD EPYC 7313P – Optimized Power for Modern Servers
Deliver high-efficiency processing with the AMD EPYC 7313P, designed to strike the perfect balance between performance, scalability, and reliability in enterprise-grade server deployments.

Octa-Channel Memory for Maximum Bandwidth
With eight DDR4 memory channels supporting up to 3200 MHz, the EPYC 7313P provides massive bandwidth to meet the demands of virtualization, high-performance computing, and intensive data processing.

Socket SP3 Compatibility for Infrastructure Stability
Engineered for full compatibility with AMD's robust SP3 ecosystem, this processor easily integrates with proven server platforms—delivering consistency, efficiency, and thermal reliability.

Built for the Server Market Segment
Optimized specifically for modern data center workloads, the EPYC 7313P is your go-to choice for cloud-native applications, virtualization, and enterprise IT environments.

Trusted AMD Architecture for Mission-Critical Uptime
Backed by AMD’s legacy of server innovation, the EPYC 7313P delivers secure, stable, and predictable compute performance—so your infrastructure keeps running, even when the workloads surge.

Specifications

Processor
Processor generation AMD EPYC™ 7003 Series
Processor base frequency 3 GHz
Processor manufacturer AMD
Configurable TDP-down 155 W
Thermal Design Power (TDP) 155 W
Processor cache 128 MB
Processor model 7313P
Processor threads 32
Processor boost frequency 3.7 GHz
Component for Server/workstation
Processor family AMD EPYC
Processor cores 16
Processor socket Socket SP3
Configurable TDP-up 180 W
Processor cache type L3
Package type Tray
Memory
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Memory channels Octa-channel
Memory bandwidth (max) 204.8 GB/s
Power
Configurable TDP-down 155 W
Thermal Design Power (TDP) 155 W
Technical details
PCI Express slots version 4.0
Thermal Design Power (TDP) 155 W
Market segment Server
Configurable TDP-up 180 W
Processor cache type L3
Features
Maximum number of PCI Express lanes 128
Thermal Design Power (TDP) 155 W
PCI Express slots version 4.0
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Configurable TDP-up 180 W
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119

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