Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) FURY Impact

Key Features

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality*
• Intel XMP-ready profiles
• Ready for AMD Ryzen
• Higher performance with low power consumption
• Slim form, sleek design

Description

8GB, 16GB and 32GB capacities up to 3200MT/s
Get your notebook or small-form-factor machine fully equipped with Kingston FURY™ Impact DDR4 SODIMM and minimise system lag. Ready for AMD Ryzen™, Intel® XMP-ready and XMP Certified in kit capacities of up to 64GB, FURY Impact DDR4 features Kingston’s innovative Plug N Play* overclocking technology, which automatically engages the factory preset speed and latency timings without having to change any settings in the BIOS. Designed to run cool, quiet and efficiently at only 1.2V, these sleek black modules provide a hassle-free boost to your system’s performance

Powerful SODIMM performance
Maximise your memory and get a boost to your gaming, multitasking and rendering.

Plug N Play automatic overclocking functionality*
Impact DDR4 automatically overclocks itself to the highest published frequency.

Intel® XMP-ready and XMP Certified
Designed to maximise the performance of our memory modules, our engineers have predefined Intel Extreme Memory Profiles to reach speeds of up to 3200MT/s.

Ready for AMD Ryzen™
Get memory that’s Ready for AMD Ryzen and will seamlessly integrate with your AMD-based SODIMM-compatible system. A reliable, compatible performance boost for your build.

Higher performance with low power consumption
Run your system cool and efficiently with Impact DDR4’s low 1.2V power draw.

Slim form factor, sleek design
The black PCB and sleek thermal label deliver big style with a small footprint.

Specifications

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16.6 g
Package weight	45.6 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	45.6 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.35 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020