XPG LANCER BLADE memory module 16 GB 1 x 16 GB DDR5 ECC

16 GB, DDR5, 6000 MT/s, 1.35 V, CL 30, XMP 3.0, AMD EXPO, ECC, Black

Key Features

• Compact Low-Profile Heatsink Design
• PMIC for power supply stability
• On-die ECC error correction
• High-quality materials for stable overclocking
• Works with the Latest AMD Platforms
• Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking

Description

LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER

Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.

Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.

Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.

Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.

AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.

Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.

Specifications

Memory
Package type	Blister
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC
CAS latency	30
Memory voltage	1.35 V
ECC	Yes
Internal memory type	DDR5
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Cooling type	Heatsink
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC
CAS latency	30
Memory voltage	1.35 V
Cooling type	Heatsink
ECC	Yes
Internal memory type	DDR5
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-20 - 65 °C
Weight & dimensions
Package width	70 mm
Package depth	170 mm
Package height	12.2 mm
Width	133.3 mm
Depth	33.8 mm
Height	7.8 mm
Weight	32.92 g
Package type	Blister
Package weight	51.64 g
Packaging data
Package width	70 mm
Package depth	170 mm
Package height	12.2 mm
Package type	Blister
Package weight	51.64 g